Underfill Adhesives
Underfill is a thermoset epoxy adhesives between semiconductor package (CSP, BGA, WLP) and PCB.
It is located between the package and FR-4 board in order to reduce physical and chemical impact.
They distributes the stress caused by the difference of thermal expansion coeffecient between the chip and substrate, thereby improving reliability of parts
Fast Cure, Excellent adhesion Good toughness, Good water absorption Applications : Home appliances, Mobile devices, Wearable devices, Automobile modules |
Fast Cure, Long pot life Excellent drop impact, Excellent re-workability Applications : Home appliances, Mobile devices, Wearable devices |
Fast Cure, Low viscosity, High Tg Excellent thermal shock reliability Applications : Home appliances, Mobile devices, Wearable devices, Automobile modules |
| Model | Appearance | Viscosity (cps) | Tg (°C) by DSC | CTE (ppm/°C) | Curing Conditions | Pot Life (25°C) | Storage | |||
|---|---|---|---|---|---|---|---|---|---|---|
| α1* (Below Tg) | α2* (Above Tg) | |||||||||
| 3T-1007N | Light Yellow | 3,000±800 | 78 | 60 | 226 | 135°C/15min, 150°C/10min | 7 days | 6 months <-20°C | ||
| 3T-3008L | Light Yellow | 2,800±800 | 7 | 80 | 230 | 135°C/15min, 150°C/10min | 7 days | 6 months <10°C | ||
| 3T-3008S1 | Light Yellow | 2,800±800 | 7 | 58 | 210 | 135°C/5min, 150°C/3min | 20 days | 6 months <10°C | ||
| 3T-3008SN | Light Yellow | 2,500±800 | 10 | 60 | 210 | 135°C/10min, 150°C/5min | 20 days | 6 months <10°C | ||
| 3T-3300 | Light Yellow | 2,500±800 | 15 | 60 | 250 | 135°C/10min, 150°C/5min | 20 days | 6 months <10°C | ||
| 3T-7000 | Light Yellow | 2,500±800 | 95 | 58 | 200 | 120°C/20min, 135°C/10min | 3 days | 6 months <-20°C | ||
| 3T-7105 | Black | 600±100 | 100 | 58 | 210 | 120°C/20min, 135°C/10min | 3 days | 6 months <-20°C | ||
| 3T-7300 | Light Yellow | 500±100 | 100 | 58 | 210 | 120°C/20min, 135°C/10min | 3 days | 6 months <-20°C | ||
