Underfill Adhesives

Underfill is a thermoset epoxy adhesives between semiconductor package (CSP, BGA, WLP) and PCB.

It is located between the package and FR-4 board in order to reduce physical and chemical impact.

They distributes the stress caused by the difference of thermal expansion coeffecient between the chip and substrate, thereby improving reliability of parts



Underfill WE-1000

Fast Cure, Excellent adhesion

Good toughness, Good water absorption

Applications : Home appliances, Mobile devices, Wearable devices, Automobile modules

Underfill WE-3000

Fast Cure, Long pot life

Excellent drop impact, Excellent re-workability

Applications : Home appliances, Mobile devices, Wearable devices

Underfill WE-7000

Fast Cure, Low viscosity, High Tg

Excellent thermal shock reliability

Applications : Home appliances, Mobile devices, Wearable devices, Automobile modules



Model Appearance Viscosity (cps) Tg (°C) by DSC CTE (ppm/°C) Curing Conditions Pot Life (25°C) Storage





α1* (Below Tg) α2* (Above Tg)



3T-1007N Light Yellow 3,000±800 78 60 226 135°C/15min, 150°C/10min 7 days 6 months <-20°C
3T-3008L Light Yellow 2,800±800 7 80 230 135°C/15min, 150°C/10min 7 days 6 months <10°C
3T-3008S1 Light Yellow 2,800±800 7 58 210 135°C/5min, 150°C/3min 20 days 6 months <10°C
3T-3008SN Light Yellow 2,500±800 10 60 210 135°C/10min, 150°C/5min 20 days 6 months <10°C
3T-3300 Light Yellow 2,500±800 15 60 250 135°C/10min, 150°C/5min 20 days 6 months <10°C
3T-7000 Light Yellow 2,500±800 95 58 200 120°C/20min, 135°C/10min 3 days 6 months <-20°C
3T-7105 Black 600±100 100 58 210 120°C/20min, 135°C/10min 3 days 6 months <-20°C
3T-7300 Light Yellow 500±100 100 58 210 120°C/20min, 135°C/10min 3 days 6 months <-20°C

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