Underfill is a thermoset epoxy adhesives between semiconductor package (CSP, BGA, WLP) and PCB.
It is located between the package and FR-4 board in order to reduce physical and chemical impact.
Fast cure over 60 ° °C ~ 80 ° ° C which can be applied to various adhered materials such as plastic materials, glass and metals.
Used for applications such as Camera module, Fingerprint module, Speaker module, Glob-top encapsulants, LED BLU
Fast curing within a short time, and the process is simple, which maximizes customers' productivity
Viscosity, rigidity, glass transition temperature, hardness, flexibility and toughness can be adjusted stably depending on the applied materials.
Applications: Camera module, Speaker module, Dust capturing adhesive, Glob-top encapsulant
Mainly used for the purpose of preventing lens distortion.
In case of thermal curing, when the camera lens is moved in the production line, a defocus phenomenon occured due to vibration.This causes defects
To solve this problem, the primary UV-Cured bonding process (instant temporary bonding) aligns the lens position.
After that, the lens is completely cured by the secondary heat-cured bonding process